Handbook of 3D Integration, Volume 4

Handbook of 3D Integration, Volume 4

  • Paul D. Franzon
  • Erik Jan Marinissen
  • Muhannad S. Bakir
Publisher:John Wiley & SonsISBN 13: 9783527338559ISBN 10: 3527338551

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Know about the book -

Handbook of 3D Integration, Volume 4 is written by Paul D. Franzon and published by John Wiley & Sons. It's available with International Standard Book Number or ISBN identification 3527338551 (ISBN 10) and 9783527338559 (ISBN 13).

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.