Testing of Interposer-Based 2.5D Integrated Circuits

Know about the book -

Testing of Interposer-Based 2.5D Integrated Circuits is written by Ran Wang and published by Springer. It's available with International Standard Book Number or ISBN identification 3319547143 (ISBN 10) and 9783319547145 (ISBN 13).

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.