New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

  • Nabil Shovon Ashraf
  • Shawon Alam
  • Mohaiminul Alam
Publisher:Morgan & Claypool PublishersISBN 13: 9781627058551ISBN 10: 1627058559

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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation is written by Nabil Shovon Ashraf and published by Morgan & Claypool Publishers. It's available with International Standard Book Number or ISBN identification 1627058559 (ISBN 10) and 9781627058551 (ISBN 13).

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (