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System-in-Package is written by Lei He and published by Now Publishers Inc. It's available with International Standard Book Number or ISBN identification 1601984588 (ISBN 10) and 9781601984586 (ISBN 13).
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.