3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
- Lih-Tyng Hwang
- Tzyy-Sheng Jason Horng
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Know about the book -
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility is written by Lih-Tyng Hwang and published by John Wiley & Sons. It's available with International Standard Book Number or ISBN identification 111928967X (ISBN 10) and 9781119289678 (ISBN 13).
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
