Stress-Induced Phenomena in Metallization
- Paul S. Ho
- Shefford P. Baker
- Tomoji Nakamura
- Cynthia A. Volkert
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Know about the book -
Stress-Induced Phenomena in Metallization is written by Paul S. Ho and published by American Inst. of Physics. It's available with International Standard Book Number or ISBN identification 0735402256 (ISBN 10) and 9780735402256 (ISBN 13).
These proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. Papers cover results on electromigration, thermal stresses and void formation in copper-low k interconnect structures.
