System on Package

Know about the book -

System on Package is written by Rao Tummala and published by McGraw Hill Professional. It's available with International Standard Book Number or ISBN identification 0071593322 (ISBN 10) and 9780071593328 (ISBN 13).

System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.