Ball Grid Array Technology
- John H. Lau
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Know about the book -
Ball Grid Array Technology is written by John H. Lau and published by McGraw Hill Professional. It's available with International Standard Book Number or ISBN identification 007036608X (ISBN 10) and 9780070366084 (ISBN 13).
A summary of progress in ball grid array (BGA) packaging technology, for professionals in BGA research and development, and for manufacturers researching BGA for their interconnect systems. Discusses economic, design, material, process, and quality issues, and describes techniques for processing substrates, routing PCB, assembling CBGA, PBGA, and TBGA packages, and inspection of BGA PCB assemblies. Includes treatment of BGA industry infrastructure, and an electronic packaging glossary. Contains bandw photos and diagrams. Annotation copyright by Book News, Inc., Portland, OR
